Spot plating wheel is a special tool used for selective plating of lead frame of specific electronic products on the general roll to roll plating production line. The spot plating wheel positions the lead frame through ceramic nails, and uses silica gel parts to accurately seal the parts that are not allowed to be plated and isolate the contact area of the plating solution. Selective electroplating is a high-speed and economical electroplating method, which is suitable for selective precious metal (gold plating, silver plating, palladium nickel plating, tin plating) on the lead frame of connectors, led, ASMD, IC, diode, triode and other electronic components. Due to the purposeful selective electroplating of functional areas, the electroplating area is small, which can achieve high speed (max = 30mpm) and save precious metals.